𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model

✍ Scribed by Xiaoyan Liu; Yuling Liu; Yan Liang; Haixiao Liu; Zhiwen Zhao; Baohong Gao


Book ID
113937109
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
485 KB
Volume
520
Category
Article
ISSN
0040-6090

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES