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[IEEE Seventh International IEEE Conference on VLSI Multilevel Interconnection - Santa Clara, CA, USA (12-13 June 1990)] Seventh International IEEE Conference on VLSI Multilevel Interconnection - Advantages of dual frequency PECVD for deposition of ILD and passivation films

✍ Scribed by van de Ven, E.P.; Connick, I.-W.; Harrus, A.S.

Book ID: 121651669
Publisher: IEEE
Year: 1990
Weight: 370 KB
Category: Article
DOI: 10.1109/VMIC.1990.127865

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