[IEEE Seventh International IEEE Conference on VLSI Multilevel Interconnection - Santa Clara, CA, USA (12-13 June 1990)] Seventh International IEEE Conference on VLSI Multilevel Interconnection - Formation of self-aligned TiN/CoSi/sub 2/ bilayer from Co/Ti/Si and its applications in salicide, diffusion barrier and contact fill

✍ Scribed by Wei, C.-S.; Fraser, D.B.; Dass, M.L.A.; Brat, T.

• Book ID: 118037039
• Publisher: IEEE
• Year: 1990
• Weight: 755 KB
• Volume: 0
• Category: Article
• DOI: 10.1109/vmic.1990.127871