𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Seventh International IEEE Conference on VLSI Multilevel Interconnection - Santa Clara, CA, USA (12-13 June 1990)] Seventh International IEEE Conference on VLSI Multilevel Interconnection - Sub-atmospheric chemical vapor deposition (SACVD) of TEOS-ozone USG and BPSG

✍ Scribed by Lee, P.; Galiano, M.; Keswick, P.; Wong, J.; Shin, B.; Wang, D.

Book ID: 120264045
Publisher: IEEE
Year: 1990
Weight: 319 KB
Category: Article
DOI: 10.1109/VMIC.1990.127910

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Seventh International IEEE Confere

[IEEE Seventh International IEEE Conference on VLSI Multilevel Interconnection - Santa Clara, CA, USA (12-13 June 1990)] Seventh International IEEE Conference on VLSI Multilevel Interconnection - Characterization and simulation of PECVD and APCVD oxide step coverage

✍ Lesaicherre, P.-Y.; Gerodolle, A.; Brouquet, P.; Rossiter, N. 📂 Article 📅 1990 🏛 IEEE ⚖ 689 KB

[IEEE Seventh International IEEE Confere

[IEEE Seventh International IEEE Conference on VLSI Multilevel Interconnection - Santa Clara, CA, USA (12-13 June 1990)] Seventh International IEEE Conference on VLSI Multilevel Interconnection - Electron cyclotron resonance (ECR) deposited SiO/sub 2/ films for interlayer dielectric application

✍ Chiang, C.; Fraser, D.B.; Denison, D.R. 📂 Article 📅 1990 🏛 IEEE ⚖ 148 KB

[IEEE Seventh International IEEE Confere

[IEEE Seventh International IEEE Conference on VLSI Multilevel Interconnection - Santa Clara, CA, USA (12-13 June 1990)] Seventh International IEEE Conference on VLSI Multilevel Interconnection - Formation of self-aligned TiN/CoSi/sub 2/ bilayer from Co/Ti/Si and its applications in salicide, diffusion barrier and contact fill

✍ Wei, C.-S.; Fraser, D.B.; Dass, M.L.A.; Brat, T. 📂 Article 📅 1990 🏛 IEEE ⚖ 755 KB