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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Highly reliable PVD/ALD/PVD stacked barrier metal structure for 45-nm node copper dual-damascene interconnects

✍ Scribed by Higashi, K.; Yamaguchi, H.; Omoto, S.; Sakata, A.; Katata, T.; Matsunaga, N.; Shibata, H.

Book ID: 126694380
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 232 KB
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/IITC.2004.1345664

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