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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - On wafer de-embedding for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization

✍ Scribed by Tretiakov, Y.; Vaed, K.; Ahlgren, D.; Rascoe, J.; Venkatadri, S.; Woods, W.

Book ID: 118217636
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 213 KB
Volume: 0
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/iitc.2004.1345728

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