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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - High performance Cu interconnects capped with full-coverage ALD TaNx layer for Cu/low-k (k∼2.5) metallization

✍ Scribed by Hsien-Ming Lee, ; Lin, J.C.; Peng, C.H.; Pan, S.C.; Huang, C.L.; Su, L.L.; Hsieh, C.H.; Shue, W.S.; LIang, M.S.

Book ID: 126611858
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 225 KB
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/IITC.2004.1345690

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