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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Integration and performances of an alternative approach using copper silicide as a self-aligned barrier for 45 nm technology node Cu interconnects

✍ Scribed by Gosset, L.G.; Chhun, S.; Farcy, A.; Casanova, N.; Arnal, V.; Besling, W.F.A.; Torres, J.

Book ID: 121811151
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 212 KB
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/IITC.2004.1345667

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