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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Pore-sealing by etch-byproduct followed by ALD-Ta adhesion layer for Cu/porous low-k interconnects

✍ Scribed by Furuya, A.; Soda, E.; Yoneda, K.; Yoshie, T.; Okamura, H.; Shimada, M.; Ohtsuka, N.; Ogawa, S.

Book ID: 126536808
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 250 KB
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/IITC.2004.1345677

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