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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

✍ Scribed by Landers, W.; Edelstein, D.; Clevenger, L.; Das, C.; Yang, C.-C.; Aoki, T.; Beaulieu, F.; Casey, J.; Cowley, A.; Cullinan, M.; Daubenspeck, T.; Davis, C.; Demarest, J.; Duchesne, E.; Guerin, L.; Hawken, D.; Ivers, T.; Lane, M.; Liu, X.; Lombardi, T.; McCarthy, C.; Muzzy, C.; Nadeau-Filteau, J.; Questad, D.; Sauter, W.; Shaw, T.; Wright, J.

Book ID: 126689848
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 239 KB
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/IITC.2004.1345706

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