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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Robust low-k film (k=2.1∼2.5) for 90/65 nm BEOL technology using bilayer film schemes

✍ Scribed by Chang, H.L.; Lu, Y.C.; Li, L.P.; Chen, B.T.; Lin, K.C.; Jeng, S.M.; Jang, S.M.; Liang, M.S.

Book ID: 126678303
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 259 KB
Category: Article
ISBN-13: 9780780383081
DOI: 10.1109/IITC.2004.1345735

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