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[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Influence of material combination on warpage and reflow crack resistance of PBGA

✍ Scribed by Kousaka, T.; Suzuki, N.; Yasuda, M.

Book ID: 126625826
Publisher: IEEE
Year: 1998
Weight: 519 KB
Category: Article
ISBN-13: 9780780351417
DOI: 10.1109/EPTC.1998.756019

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