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[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - A fast, low cost method to check for moisture in epoxy molding compound

✍ Scribed by Lin, J.; Teng, A.; Yuen, M.M.F.

Book ID: 126743176
Publisher: IEEE
Year: 1998
Weight: 227 KB
Category: Article
ISBN-13: 9780780351417
DOI: 10.1109/EPTC.1998.756030

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