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[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Measurement on thermal properties of solid films in electronic packages

✍ Scribed by Shi, X.Q.; Pang, H.L.J.; Zhou, W.; Yang, Q.J.

Book ID: 125849313
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 373 KB
Category: Article
ISBN-13: 9780780351417
DOI: 10.1109/EPTC.1998.756021

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