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[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Direct approach to the design of plate fin heat sinks stack cooled by forced convection

✍ Scribed by Gugliermetti, F.; Grignaffini, S.

Book ID: 120904433
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 357 KB
Category: Article
ISBN-13: 9780780351417
DOI: 10.1109/EPTC.1998.755992

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