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[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics

✍ Scribed by Lim, J.H.; Lee, K.W.; Park, S.S.; Earmme, Y.Y.

Book ID: 126599705
Publisher: IEEE
Year: 1998
Weight: 525 KB
Category: Article
ISBN-13: 9780780351417
DOI: 10.1109/EPTC.1998.755976

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