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[IEEE 3rd Electronics Packaging Technology Conference - Singapore (5-7 Dec 2000)] Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) - Cracking analysis of plastic IC package in consideration of viscoelasticity

✍ Scribed by Ji Hyuck Yang, ; Kang Yong Lee,

Book ID: 120834083
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 572 KB
Category: Article
ISBN-13: 9780780366442
DOI: 10.1109/EPTC.2000.906382

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