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[IEEE 3rd Electronics Packaging Technology Conference - Singapore (5-7 Dec 2000)] Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) - A new approach for system integrated packaging

✍ Scribed by Aschenbrenner, R.; Ostmann, A.; Jung, E.; Landesberger, C.; Reichl, H.

Book ID: 126758125
Publisher: IEEE
Year: 2000
Weight: 657 KB
Category: Article
ISBN-13: 9780780366442
DOI: 10.1109/EPTC.2000.906347

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