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[IEEE 3rd Electronics Packaging Technology Conference - Singapore (5-7 Dec 2000)] Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) - Thermal characterization of vias using compact models

✍ Scribed by Pinjala, D.; Iyer, M.K.; Chow Seng Guan, ; Rasiah, I.J.

Book ID: 118023902
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 380 KB
Volume: 0
Category: Article
ISBN-13: 9780780366442
DOI: 10.1109/eptc.2000.906363

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