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[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Direct wafer bonding for photonic MEMS and packaging applications

✍ Scribed by Arokiaraj, J.; Cao Yu, ; Vicknesh, S.; Mithilesh, S.; Ramam, A.

Book ID: 120230551
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 280 KB
Category: Article
ISBN-13: 9780780388215
DOI: 10.1109/EPTC.2004.1396602

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