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[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Harsh solder joint reliability tests by impact drop and highly accelerated life test (HALT)

✍ Scribed by Che, F.X.; Pang, J.H.L.

Book ID: 125529923
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 394 KB
Category: Article
ISBN-13: 9780780388215
DOI: 10.1109/EPTC.2004.1396604

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