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[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A new failure analysis approach to predict and localize defects and weakness areas in trough-glass-vias for a multifunctional package level camera

✍ Scribed by El Amrani, A.; Bouya, M.; Bouissa, Y.; Benali, A.; Faqir, M.; Ghogho, M.; Hadjoudja, A.; Hlou, L.

Book ID: 121336586
Publisher: IEEE
Year: 2013
Weight: 702 KB
Category: Article
ISBN: 1479912417
DOI: 10.1109/IPFA.2013.6599196

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