𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability and failure analysis in designing a typical operation amplifier

✍ Scribed by Chang, W. L.; Luo, J. Y.; Qi, Y.; Wang, B.

Book ID: 121273124
Publisher: IEEE
Year: 2010
Weight: 229 KB
Category: Article
ISBN: 1424455960
DOI: 10.1109/IPFA.2010.5531973

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 17th IEEE International Sympo

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Electromigration anisotropy and mechanical stress in modern copper interconnect

✍ Ceric, H.; de Orio, R. L.; Selberherr, S. 📂 Article 📅 2010 🏛 IEEE ⚖ 657 KB

[IEEE 2010 17th IEEE International Sympo

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Hot-carrier degradation modeling using full-band Monte-Carlo simulations

✍ Tyaginov, S.E.; Starkov, I.A.; Triebl, O.; Cervenka, J.; Jungemann, C.; Carniell 📂 Article 📅 2010 🏛 IEEE ⚖ 486 KB

[IEEE 2010 17th IEEE International Sympo

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

✍ Kor, H. B.; Chang, A. C. K.; Gan, C. L. 📂 Article 📅 2010 🏛 IEEE ⚖ 259 KB

[IEEE 2010 17th IEEE International Sympo

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Hot carrier stress induced negative differential resistance in the output characteristic of poly-Si TFTs

✍ Hu, Chunfeng; Wang, Mingxiang; Xu, Meijuan 📂 Article 📅 2010 🏛 IEEE ⚖ 241 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Ultrafast submicron thermal characterization of integrated circuits

✍ Shakouri, Ali; Maize, Kerry; Jackson, Philip; Wang, Xi; Vermeersch, Bjorn; Yazaw 📂 Article 📅 2012 🏛 IEEE ⚖ 302 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Copper oxidation study by TEM

✍ Esa, Siti Rahmah; Yahya, Rosiyah; Hassan, Aziz; Omar, Ghazali 📂 Article 📅 2012 🏛 IEEE ⚖ 65 KB