𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Copper oxidation study by TEM

✍ Scribed by Esa, Siti Rahmah; Yahya, Rosiyah; Hassan, Aziz; Omar, Ghazali

Book ID: 120641927
Publisher: IEEE
Year: 2012
Weight: 65 KB
Category: Article
ISBN: 1467309826
DOI: 10.1109/IPFA.2012.6306315

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Ultrafast submicron thermal characterization of integrated circuits

✍ Shakouri, Ali; Maize, Kerry; Jackson, Philip; Wang, Xi; Vermeersch, Bjorn; Yazaw 📂 Article 📅 2012 🏛 IEEE ⚖ 302 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Impact of gate oxide thickness variations on hot-carrier degradation

✍ Tyaginov, S. E.; Starkov, I. A.; Triebl, O.; Karner, M.; Kernstock, Ch.; Jungema 📂 Article 📅 2012 🏛 IEEE ⚖ 401 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - 3D FinFET and other sub-22nm transistors

✍ Hu, Chenming 📂 Article 📅 2012 🏛 IEEE ⚖ 666 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Diffusion ability of Stress Induced Voiding in advanced BEOL copper process

✍ Huang, Clement; Liang, James W.; Juan, Alex; Su, K. C. 📂 Article 📅 2012 🏛 IEEE ⚖ 688 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - The link between NBTI and TDDB of high-k gate P-MOSFETs

✍ Gao, Y.; Ang, D. S. 📂 Article 📅 2012 🏛 IEEE ⚖ 223 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - 1/f Noise measurement and its doping dependencies of Si Hall sensors

✍ Sun, Kai; Wang, Mingxiang 📂 Article 📅 2012 🏛 IEEE ⚖ 324 KB