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[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Diffusion ability of Stress Induced Voiding in advanced BEOL copper process

✍ Scribed by Huang, Clement; Liang, James W.; Juan, Alex; Su, K. C.

Book ID: 118052535
Publisher: IEEE
Year: 2012
Weight: 688 KB
Category: Article
ISBN: 1467309826
DOI: 10.1109/ipfa.2012.6306247

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