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[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

✍ Scribed by Kor, H. B.; Chang, A. C. K.; Gan, C. L.

Book ID: 121738918
Publisher: IEEE
Year: 2010
Weight: 259 KB
Category: Article
ISBN: 1424455960
DOI: 10.1109/IPFA.2010.5531987

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