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[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Electromigration anisotropy and mechanical stress in modern copper interconnect

✍ Scribed by Ceric, H.; de Orio, R. L.; Selberherr, S.

Book ID: 120048148
Publisher: IEEE
Year: 2010
Weight: 657 KB
Category: Article
ISBN: 1424455960
DOI: 10.1109/IPFA.2010.5532224

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