𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure rate calculation for NMOS devices under multiple failure mechanisms

✍ Scribed by Zhenwei Zhou, ; Xin Liu, ; Qian Shi, ; Yunfei En, ; Xiaohan Wang,

Book ID: 121219651
Publisher: IEEE
Year: 2013
Weight: 665 KB
Category: Article
ISBN: 1479912417
DOI: 10.1109/IPFA.2013.6599182

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2013 20th IEEE International Sympo

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Reliability of oxide TFT for display application

✍ Jang, J.; Um, J. K.; Mativenga, M. 📂 Article 📅 2013 🏛 IEEE ⚖ 1018 KB

[IEEE 2013 20th IEEE International Sympo

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - The worst stress condition of hot carrier degradation on high voltage LDMOSFET

✍ Sarah Zhou Huayang, ; Yongliang Song, ; Zhuo Song, ; Lisa Yu Yanju, ; Atman Zhao 📂 Article 📅 2013 🏛 IEEE ⚖ 161 KB

[IEEE 2013 20th IEEE International Sympo

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Reliability of 10Gb/s 850nm oxide confined vertical cavity surface emitting lasers

✍ Meng Haijie, ; Zhang Zhenfeng, ; Wang Shancheng, ; Ding Guoqing, ; Zhou Zhonghua 📂 Article 📅 2013 🏛 IEEE ⚖ 188 KB

[IEEE 2013 20th IEEE International Sympo

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A new failure analysis approach to predict and localize defects and weakness areas in trough-glass-vias for a multifunctional package level camera

✍ El Amrani, A.; Bouya, M.; Bouissa, Y.; Benali, A.; Faqir, M.; Ghogho, M.; Hadjou 📂 Article 📅 2013 🏛 IEEE ⚖ 702 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Ultrafast submicron thermal characterization of integrated circuits

✍ Shakouri, Ali; Maize, Kerry; Jackson, Philip; Wang, Xi; Vermeersch, Bjorn; Yazaw 📂 Article 📅 2012 🏛 IEEE ⚖ 302 KB

[IEEE 2011 18th IEEE International Sympo

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Interconnect processes and reliability for RF technology

✍ Gambino, J.P.; Anderson, F.; Cooney, E.; He, J.; Bolam, R.; Webb, B.C.; Cabral, 📂 Article 📅 2011 🏛 IEEE ⚖ 1006 KB