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[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Interconnect processes and reliability for RF technology

✍ Scribed by Gambino, J.P.; Anderson, F.; Cooney, E.; He, J.; Bolam, R.; Webb, B.C.; Cabral, C.; Shaw, T.; Vanslette, D.

Book ID: 120006476
Publisher: IEEE
Year: 2011
Weight: 1006 KB
Category: Article
ISBN: 1457701596
DOI: 10.1109/IPFA.2011.5992796

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