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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Scalable modeling and wideband measurement techniques for a signal TSV surrounded by multiple ground TSVs for RF/high-speed applications

✍ Scribed by Lu, Kuan-Chung; Horng, Tzyy-Sheng; Li, Hsin-Hung; Fan, Kung-Chin; Huang, Tzu-Yuan; Lin, Chun-Hsun

Book ID: 118125151
Publisher: IEEE
Year: 2012
Weight: 635 KB
Category: Article
ISBN: 1467319643
DOI: 10.1109/ectc.2012.6248961

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