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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Electromigration behavior of 3D-IC TSV interconnects

✍ Scribed by Frank, Thomas; Moreau, Stephane; Chappaz, Cedrick; Arnaud, Lucile; Leduc, Patrick; Thuaire, Aurelie; Anghel, Lorena

Book ID: 115534932
Publisher: IEEE
Year: 2012
Weight: 843 KB
Category: Article
ISBN: 1467319643
DOI: 10.1109/ectc.2012.6248850

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