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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - A new methodology for board-level harmonic analysis of multi-level packages

✍ Scribed by Chen, Cheng-fu

Book ID: 115542428
Publisher: IEEE
Year: 2012
Weight: 572 KB
Category: Article
ISBN: 1467319643
DOI: 10.1109/ectc.2012.6249088

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