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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Copper conductive adhesives for printed circuit interconnects

✍ Scribed by Qi, Siyuan; Litchfield, Robert; Hutt, David A.; Vaidhyanathan, Bala; Liu, Changqing; Webb, Patrick; Ebbens, Stephen

Book ID: 115542427
Publisher: IEEE
Year: 2012
Weight: 832 KB
Category: Article
ISBN: 1467319643
DOI: 10.1109/ectc.2012.6249059

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