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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Vertical tree 3-dimensional TSV clock distribution network in 3D IC

✍ Scribed by Kim, Dayoung; Kim, Joohee; Pak, Junso; Lee, Hyungdong; Lee, Junho; Park, Kunwoo; Kim, Joungho

Book ID: 115535691
Publisher: IEEE
Year: 2012
Weight: 822 KB
Category: Article
ISBN: 1467319643
DOI: 10.1109/ectc.2012.6249105

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