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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Effect of the lattice mismatch between copper thin-film interconnection and base material on the crystallinity of the interconnection

✍ Scribed by Chuanhong Fan, ; Asai, Osamu; Suzuki, Ken; Miura, Hideo

Book ID: 120635862
Publisher: IEEE
Year: 2012
Weight: 920 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507865

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