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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Evaluation of the crystallographic quality of electroplated copper thin-film interconnections embedded in TSV structures

✍ Scribed by Furuya, Ryosuke; Suzuki, Ken; Miura, Hideo

Book ID: 120635861
Publisher: IEEE
Year: 2012
Weight: 643 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507852

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