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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Evaluation of the crystallographic quality of electroplated copper thin-film interconnections embedded in TSV structures

โœ Scribed by Furuya, Ryosuke; Suzuki, Ken; Miura, Hideo


Book ID
120635861
Publisher
IEEE
Year
2012
Weight
643 KB
Category
Article
ISBN
1467349437

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