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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Effects of molding compounds on warpage and damage of PBGA after post mold cure

✍ Scribed by Lam, Tatiana M.; Yi, Sung

Book ID: 120295923
Publisher: IEEE
Year: 2012
Weight: 527 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507877

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