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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Through Silicon Via (TSV) redundancy - a high reliability, networking product perspective

✍ Scribed by Poh Choon Chew, ; Li Li, ; Jie Xue, ; Eklow, William

Book ID: 120635860
Publisher: IEEE
Year: 2012
Weight: 475 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507851

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