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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Preparation and performance research on the Si3N4@SiO2/PI nanocomposite

✍ Scribed by Jing Qin, ; Guoping Zhang, ; Rong Sun, ; Chingping Wong,

Book ID: 125417372
Publisher: IEEE
Year: 2012
Weight: 506 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507895

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