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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Different morphologies of nano-ZnO affection on properties of transparent epoxy resin encapsulants

✍ Scribed by Peng, Chongnan; Zhang, Guoping; Sun, Rong; Lee, Ricky

Book ID: 121846682
Publisher: IEEE
Year: 2012
Weight: 368 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507893

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