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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Thermal performance and placement design of LED array package on PCB

✍ Scribed by Yung, K.C.; Liem, H.M.; Choy, H.S.

Book ID: 124057013
Publisher: IEEE
Year: 2012
Weight: 510 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507915

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