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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - An investigation on secondary EFO copper wire - from a nanoscale perspective view

✍ Scribed by Hsu, Hsiang-Chen; Chien, Jih-Hsin; Wang, Chen-Yi; Liu, Cheng-Che; Fu, Shen-Li; Bair, Miin Shyan

Book ID: 125470736
Publisher: IEEE
Year: 2012
Weight: 691 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/emap.2012.6507897

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