𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging

✍ Scribed by Wu, H. L. Henry; Lee, S. W. Ricky

Book ID: 120810801
Publisher: IEEE
Year: 2011
Weight: 667 KB
Category: Article
ISBN: 1457713888
DOI: 10.1109/IMPACT.2011.6117173

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fault-tolerant mesh for 3D network on chip

✍ Hsieh, Kai-Yang; Cheng, Bo-Chuan; Gu, Ruei-Ting; Li, Katherine Shu-Min 📂 Article 📅 2011 🏛 IEEE ⚖ 864 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Advanced high density interconnection substrate for mobile platform application

✍ Romero, Christian; Park, Seungwook; Kweon, Youngdo; Park, Mijin 📂 Article 📅 2011 🏛 IEEE ⚖ 880 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration

✍ Hsieh, Ming-Che; Wu, Sheng-Tsai; Li, Wei; Tain, Ra-Min; Lau, John H.; Lo, Robert 📂 Article 📅 2011 🏛 IEEE ⚖ 955 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder

✍ Hsieh, Peishan; Lin, Kwang-Lung 📂 Article 📅 2011 🏛 IEEE ⚖ 732 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Performance of shrouded pin-fin and plate-fin heat sinks with a concentrated heat source

✍ Shyu, Jin-Cherng; Lai, Ying-Hui 📂 Article 📅 2011 🏛 IEEE ⚖ 705 KB

[IEEE 2012 7th International Microsystem

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Experimental study on the performance of compact heat sink for LSI packages

✍ Hatakeyama, Tomoyuki; Ishizuka, Masaru; Kibushi, Risako 📂 Article 📅 2012 🏛 IEEE ⚖ 820 KB