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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Experimental study on the performance of compact heat sink for LSI packages

✍ Scribed by Hatakeyama, Tomoyuki; Ishizuka, Masaru; Kibushi, Risako

Book ID: 121348122
Publisher: IEEE
Year: 2012
Weight: 820 KB
Category: Article
ISBN: 1467316377
DOI: 10.1109/IMPACT.2012.6420225

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