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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermo-mechanical analysis of thermoelectric modules

✍ Scribed by Li, Sheng-Liang; Liu, Chun-Kai; Hsu, Chung-Yen; Hsieh, Ming-Che; Dai, Ming-Ji; Wu, Sheng-Tsai

Book ID: 115517130
Publisher: IEEE
Year: 2010
Weight: 366 KB
Volume: 0
Category: Article
ISBN: 1424497833
DOI: 10.1109/impact.2010.5699512

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