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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Advanced high density interconnection substrate for mobile platform application

✍ Scribed by Romero, Christian; Park, Seungwook; Kweon, Youngdo; Park, Mijin

Book ID: 111875654
Publisher: IEEE
Year: 2011
Weight: 880 KB
Volume: 0
Category: Article
ISBN: 1457713888
DOI: 10.1109/impact.2011.6117163

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