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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Analysis of bump resistance and electrical distribution of ultra-fine-pitch microbumps

✍ Scribed by Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.

Book ID: 118064086
Publisher: IEEE
Year: 2010
Weight: 265 KB
Volume: 0
Category: Article
ISBN: 1424497833
DOI: 10.1109/impact.2010.5699604

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