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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting

✍ Scribed by Lee, Moon-Ho; Lee, Tae Jin; Lee, Hye Jin; Kim, Young-Joo

Book ID: 118146426
Publisher: IEEE
Year: 2010
Weight: 287 KB
Volume: 0
Category: Article
ISBN: 1424497833
DOI: 10.1109/impact.2010.5699479

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