[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Performance of shrouded pin-fin and plate-fin heat sinks with a concentrated heat source

✍ Scribed by Shyu, Jin-Cherng; Lai, Ying-Hui

• Book ID: 115475389
• Publisher: IEEE
• Year: 2011
• Weight: 705 KB
• Volume: 0
• Category: Article
• ISBN: 1457713888
• DOI: 10.1109/impact.2011.6117270