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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fault-tolerant mesh for 3D network on chip

✍ Scribed by Hsieh, Kai-Yang; Cheng, Bo-Chuan; Gu, Ruei-Ting; Li, Katherine Shu-Min

Book ID: 120037330
Publisher: IEEE
Year: 2011
Weight: 864 KB
Category: Article
ISBN: 1457713888
DOI: 10.1109/IMPACT.2011.6117292

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